台湾产千住锡膏 M705-S101HF-S4
产品简介
锡96.5、银3.0、铜0.5###熔点:217-220℃###190±20Pa.s###230-260℃###要求无卤素的复杂电子产品制造###0-10℃
产品详细信息
台湾产千住锡膏
台湾产千住锡膏 ECO SOLDER PASTE M705-S101HF-S4
1.Scope
This specification covers the solder paste,
ECO SOLDER PASTE M705-S101-S4, using lead-free solder alloy, used for
wiring connection and so on, of electrical and electronic parts.
2.Standard
2.1Chemical composition of solder alloy(Test method:STM-9)
Composition and impurities are prescribed as following tables
Composition ( mass% )
|
||
Ag
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Cu
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Sn
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3.0 ± 0.1
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0.50 ± 0.05
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Balance
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2.2Performance and standard
Items
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Performance Standard
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Test Method
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Appearance
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It shall not have separated flux,and shall be in a smooth pastestate.
|
STM-1
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Flux content (mass%)
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11.5 ± 1.0
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STM-5
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Viscosity of solderpaste (Pa s)
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190 ± 30
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STM-7-8
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Grain size of powder
(um)
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36 ∼25
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STM-12-4
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Copper plate corrosion test
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Shall be passed
|
STM-28-1
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Insulation resistance
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Ordinary state 1 × 10 or more After humidifying 1 × 10 or more
|
STM-30-8
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Solution resistance
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100 or more
|
STM-32
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Reflow property
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No unmelted solder nor black product shall be permissibl
|
STM-34
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