在SMT中经常遇到各类词汇,今天就讲一讲,希望对从事这行的朋友有所帮助。
CAD:Computer Aided Design)计算机辅助设计。CAM:Computer Aided Manufacturing)计算机辅助制造。CAT:Computer Aided Testing)计算机辅助测试。FPC:(Flexible Printed Circuit)柔性印制电路。PCB:(Printed Circuit Board)印制电路板。PWB:(Printed Wiring Board)印制线路板。FTH:(Plated Through Hole)通孔镀。SMT:(Surface Mount Technology)表面安装技术。SMB:(Surface Mount Board)表面安装板。SMD:(Surface Mount Devices)表面安装器件。ISO:(International Organization for Standardization)国际标准化组织。IEC:(International Electrotechnical Commision)国际电工技术委员会组织。IPC:(The Institute for International and Packaging ElectronicCircuits)美国电路互连与封装学会(标准)。MIL:(Military Standard)美国**标准。IC:(Integrated Circuit)集成电路。LSI:(Large Scale Integrated Circuit)大规模集成电路。JPC :(Japan Printed Circuit Association)日本印制电路学会。UL:(Under writers Laboratories INC)美国保险商试验室。SMOBC:(Solder Mask on Bare Copper)裸铜线路丝印阻焊油墨。AOI:(AutomatedOptical Inspection)自动光学检测。SPC:(Statistical Process Control)统计制程控制。SQC:(Statistical Quality Control)统计质量控制5S:5S管理ABC:作业制成本制度 (Activity-Based Costing)ABB:实施作业制预算制度 (Activity-Based Budgeting)ABM:作业制成本管理 (Activity-Base Management)APS:先进规画与排程系统 (Advanced Planning and Scheduling)ASP: 应用程序服务供货商(Application Service Provider)ATP:可承诺量 (Available To Promise)AVL:认可的供货商清单(Approved Vendor List)BOM:物料清单 (Bill Of Material)BPR:企业流程再造 (Business Process Reengineering)BSC:平衡记分卡 (Balanced ScoreCard)BTF:计划生产 (Build To Forecast)BTO:订单生产 (Build To Order)CPM:要径法 (Critical Path Method)CPM:每一百万个使用者会有几次抱怨(Complaint per Million)CRM :客户关系管理 (Customer Relationship Management)CRP:产能需求规划 (Capacity Requirements Planning)CTO:客制化生产 (Configuration To Order)DBR:限制驱导式排程法 (Drum-Buffer-Rope)DMT:成熟度验证(Design Maturing Testing)DVT:设计验证(Design Verification Testing)DRP:运销资源计划 (Distribution Resource Planning)DSS:决策支持系统 (Decision Support System)EC:设计变更/工程变更 (Engineer Change)EC:电子商务 (Electronic Commerce)ECRN:原件���格更改通知(Engineer Change Request Notice)EDI:电子数据交换 (Electronic Data Interchange)EIS:主管决策系统 (Executive Information System)EMC:电磁相容(Electric Magnetic Capability)EOQ:基本经济订购量 (Economic Order Quantity)ERP:企业资源规划 (Enterprise Resource Planning)FAE:应用工程师(Field Application Engineer)FCST:预估(Forecast)FMS:弹性制造系统 (Flexible Manufacture System)FQC:成品质量管理 (Finish or Final Quality Control)IPQC:制程质量管理 (In-Process Quality Control)IQC:进料质量管理 (Incoming Quality Control)ISO:国际标准化组织 (International Organization for Standardization)ISAR:首批样品认可(Initial Sample Approval Request)JIT:实时管理 (Just In Time)KM:知识管理 (Knowledge Management)L4L:逐批订购法 (Lot-for-Lot)LTC:*小总成本法 (Least Total Cost)LUC :*小单位成本 (Least Unit Cost)MES:制造执行系统 (Manufacturing Execution System)MO :制令(Manufacture Order)MPS:主生产排程 (Master Production Schedule)MRO:请修(购)单(Maintenance Repair Operation)MRP :物料需求规划 (Material Requirement Planning)MRPII:制造资源计划 (Manufacturing Resource Planning)NFCF:更改预估量的通知Notice for Changing ForecastOEM:委托代工 (Original Equipment Manufacture)ODM:委托设计与制造 (Original Design & Manufacture)OLAP:在线分析处理 (On-Line Analytical Processing)OLTP:在线事务处理 (On-Line Transaction Processing)OPT:*佳生产技术 (Optimized Production Technology)OQC:出货质量管理 (Out-going Quality Control)PDCA:PDCA管理循环 (Plan-Do-Check-Action)PDM:产品数据管理系统 (Product Data Management)PERT:计划评核术 (Program Evaluation and Review Technique)PO:订单(Purchase Order)POH:预估在手量 (Product on Hand)PR:采购申请Purchase RequestQA:质量保证(Quality Assurance)QC:质量管理(Quality Control)QCC:品管圈 (Quality Control Circle)QE:质量工程(Quality Engineering)RCCP:粗略产能规划 (Rough Cut Capacity Planning)RMA:退货验收Returned Material ApprovalROP:再订购点 (Re-Order Point)SCM :供应链管理 (Supply Chain Management)SFC:现场控制 (Shop Floor Control)SIS:策略信息系统 (Strategic Information System)SO:订单(Sales Order)SOR:特殊订单需求(Special Order Request)SPC:统计制程管制 (Statistic Process Control)TOC:限制理论 (Theory of Constraints)TPM:**生产管理Total Production ManagementTQC:**质量管理 (Total Quality Control)TQM:**质量管理 (Total Quality Management)WIP:在制品 (Work In Process) 5S管理
今天就讲这些,希望帮到大家。